Control the deposition uniformity using ring cathode by DC dischargetechnique


Simulation ofdirect current (DC) discharge plasma using COMSOL Multiphysicssoftware were used to study the uniformity of deposition on anode from DC discharge sputteringusing ring and disc cathodes, then applied it experimentally to make comparison between film thickness distribution with simulation results. Both simulation and experimental results shows that the deposition using copper ring cathode is more uniformity than disc cathode.