Modeling and study the Physical properties of a Thermal Actuator for Micro-Electromechanical systems (MEMS) Applications


The paper introduces a study of one of the most components coupled in the Micro-electromechanical system (MEMS) devices, the thermal actuator. In this study a type of micro thermal actuators modeled by commercial finite element analysis (FEA) package ANSYS.The study includes design of polysilicon micro thermal actuator and study of thermal and mechanical actuating by an electrical load. A potential difference applied across the electrical connection pads induces a current to flow through the arm and blade. The current flow and the resistivity of the polysilicon produce Joule heating (I2R) in the arm blade. The Joule heating causes the arm and the blade to heat up. Temperatures in the range of 700 - 1000 oK generated. These temperatures produce thermal strain and thermally induced deflections. All the results of nodal temperatures and mechanical deflections listed and the maximum and minimum values illustrated for each reaction using the nodal solution contour plots and graphs. The Electric potential- Nodal temperature, and Nodal Temperature-Deflection curves graphed to illustrate the behavior of electro-thermal mechanical inducing.