TY - JOUR ID - TI - Rheological Behavior of Isothermal Cured Epoxy/1,4-Diaminobenzene Systems AU - Muataz H. Ismael AU - Salah N. Farhan صلاح نوري فرحان AU - Ayad Dari Jaafar اياد داري جعفر PY - 2018 VL - 11 IS - 1 SP - 38 EP - 43 JO - DIYALA JOURNAL OF ENGINEERING SCIENCES مجلة ديالى للعلوم الهندسية SN - 19998716 26166909 AB - A novel curing agent (1,4-diaminobenzene) was used to enhance behavior of the epoxy resin system. The effect of the curing agent content (12 to 21 wt%) subjected to the isothermal curing temperatures at 80 °C to 110 °C were performed. Results indicate that the gel time was effected slightly on the viscosity when the curing temperature was higher than 90 °C and curing material consist over from 18wt %. These results explain that reaction rates caused by higher curing temperature.

ER -