TY - JOUR ID - TI - Studying The Bonding Mechanismand Microstructure for Arc Welding of Dissimiler Steel to Copper البنیة المجھریة وآلیة الربط لملحومات القوس الكھربائي غیر المتماثلة فولاذ الى النحاس AU - عبد الله عذيب مشاري PY - 2011 VL - 2 IS - 1 SP - 1 EP - 15 JO - University of Thi-Qar Journal for Engineering Sciences مجلة جامعة ذي قار للعلوم الهندسية SN - 26645564 26645572 AB - The aim of this work is to study thebonding mechanism and the microstructure of copper to steel welded by shielded metal arc welding (SMAW). The electrodes that used are ECuSi and ECuSn8thenthe examination of microstructure by optical microscopic, it is clearlyobserved that the copper side are completely interfering with epitaxial growth when using ECuSn8 but the side of steel reveal interaction waves at the interface with nonepitaxial growth. Some of fine cracks observed at the interface with ECuSi. The use of ECuSn8 explaininterfering fine blockes from the steel inside the fusion zone.

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