A STUDY OF SOME MECHANICAL PROPERTIES OF COPPER-CERAMIC INTERFACE

Abstract

Element Cu have been deposited on ceramic substrate by use of physical vapordeposition with plasma aided (Ion plating technology ) . The effect of deposition process parameter onmechanical properties of copper thin films were studied ( adhesion and microhardness ) . Also effect ofsurface nature and temperature annealing have been studied which obtained increase in adhesion andmicrohardness with increase in applied voltage and annealing . SEM study show that the smooth surfacehave good uniformity and interface type between the film and substrate .