Thin Films Ablation by Induced Forward Transfer Technique

Abstract

Laser-Induced Forward Transfer (LIFT) is a technique which enables thecontrolled transfer of a thin film material from a transparent carrier (donor) to areceiver substrate (acceptor). The receiver substrate is usually placed in paralleland close to the thin film source under air or vacuum conditions. In this workmicrodeposition of gold (Au) and Copper (Cu) thin films were deposited on glasssubstrate by Pulsed Laser Deposition (PLD). These thin films were irradiated by asingle pulse and transferred to a silver (Ag) and silicon (Si) receiver substrates. Thelaser source used for this study was a Nd-YAG Q-Switching second harmonicgeneration (SHG) Pulsed Laser with a wavelength 532nm, repetition rate 1-6 Hz,and pulse duration 10ns. Deposited size, morphology and adhesion to the receiversubstrate as a function of applied laser fluence are investigated.