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Selective Electroless Precipitation Of Copper On Non - Conductive Surfaces Using The Semiconductor Zinc Oxide.
الترسيب الانتقائي للنحاس على السطوح غير الموصلة باستخدام شبه الموصل اوكسيد الزنك

المؤلفون: Hussein Inaya Sharhan --- Mohsin Uraibi Aldokheily
ﺎﻠﻤﺠﻟﺓ: JOURNAL OF THI-QAR SCIENCE مجلة علوم ذي قار ISSN: 19918690 السنة: 2008 المجلد: 1 الاصدار: 1 الصفحات: 30-36
الجامعة: Thi-Qar University جامعة ذي قار - جامعة ذي قار

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الخلاصة

Zinc oxide layer being thermally precipitated on glass and ceramic strips ( 2x2.5 cm ) before the electroless precipitation of copper utilizing the conventional Printed Circuit Boards( PCB) technologies in conjunction with the required modifications to optimize the quality of these layers .
The roughness of ZnO films was Ra 0.02 µm and its thickness about 0.7 µm. The films being characterized by X- ray diffraction . The bivalent Pd( І І ) used as activator was reduced to Pd (0) on surface of ZnO layer by UV light in 1.5 – 2 minutes intervals .
Copper lines precipitated in the subsequent steps have an adhesion power of 2and 5 kg.mm-2 on glass and ceramic respectively . The specific conductance of the electrolessly deposited copper was found to be( 5.3x 106 )ohm-1.cm-1, and the resistivity was ( 1.8 x10 -6 )ohm.cm . From the results of this study the method could be utilized in PCB fabrication

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