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A numerical three dimensional investigation is performed to study theeffects of the heat flux and Reynolds number on the local heat transferdistribution on smooth flat plate surface impinged with normal air jet.Reynolds number based on nozzle exit condition is varied between 1000and 4000 and heat flux from 500 to 1000 W/m2.The flow domain was studied by solving Navier Stokes equations by finitevolume while the conduction in the plate was studied by solving Laplaceequation. The results are expressed in terms of flow field and isothermcontours. The temperature of the plate surface increases when heat fluxincreases. The thickness of the thermal boundary layer and plate surfacetemperature decreases when Reynolds number increases.
انجز بحث رقمي ثلاثي الابعاد لدراسة تاثیر الفیض الحراري ورقم رینولدز على توزیع انتقالحرارة موضعي من اصطدام ھواء النفث مع سطح لوح املس ، استناداً الى تغیر حالة خروج الھواء من1000 - 4000 رینولد وانبعاث حراري مابین 500 – فوھة النفاث اعتمد رقم رینولد مابین 1000.w/m2دُرس حیز التدفق بحل معادلات نافییر ستوكس بطریقة الحجم المتناھى بینما درس الانتقال الحراريعلى السطح عن طریق حل معادلة لابلاس وعُبرعن النتائج على شكل خطوط تدفق ایزوثرمیة.أضھرت النتائج ازدیاد في درجة حرارة سطح اللوح مع ازدیاد الفیض الحراري . واتضح انخفاض بدرجةحرارة سطح اللوح وسمك الطبقة الحراریة المتاخمة مع ازدیاد عدد رینولد.
heat flux --- Reynolds number --- Naviar Stokes equation --- finite volume --- الفیض الحراري، رقم رینولد --- معادلة نافییر ستوكس --- الحجم المتناھي
This study investigated numerically and experimentally fluid flow and heat transfer in the desktop PC. Three patterns of the positions of air inlet and outlet were tested to find the best one for cooling. The computer components in the present study are CPU, finned heat sink, power supply, motherboard, CD, HDD and fans. Three components which were generate heat are CPU, motherboard and power supply and there were two openings for air inlet and two for air outlet. The air inlet velocities were 1.2, 1.8, 2.4 m/s with constant CPU fan velocity. The studied parameters were the changed of inlet air velocity, powers of CPU, motherboard and PSU and the positions of inlet air. The numerical results obtained are found in a good agreement with the experimental results. The experimental results show that the maximum temperature was 81℃ at 16.5 W and 1.2 m/s. Numerical results showed that the CPU temperature reaches 89.6 ℃ at 18.5 W and 1.2 m/s. From the results, it was found that; the temperatures of the main components (PSU and motherboard) affected little by CPU power and vice versa, the finned heat sink has higher cooling efficiency and the pattern 1 was the best pattern for CPU cooling.
computational fluid dynamics --- active heat dissipation --- PC cooling --- CPU cooling --- finned heat sink --- forced convection and electronic cooling.
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